Gaya APA

AL, A, S, E. (2020). ENCYCLOPEDIA OF PACKAGING MATERIALS, PROCESSES, AND MECHANICS - SET 1: DIE-ATTACH AND WAFER BONDING TECHNOLOGY (A 4-VOLUME SET) . : Deepublish.

Gaya MLA

AL, AO, SIO-LONG, ET. "ENCYCLOPEDIA OF PACKAGING MATERIALS, PROCESSES, AND MECHANICS - SET 1: DIE-ATTACH AND WAFER BONDING TECHNOLOGY (A 4-VOLUME SET)". : Deepublish, 2020. Hukum Keluarga Islam (Ahwal Syakhshiyyah).