Gaya APA

ENCYCLOPEDIA OF PACKAGING MATERIALS, PROCESSES, AND MECHANICS - SET 1: DIE-ATTACH AND WAFER BONDING TECHNOLOGY (A 4-VOLUME SET). (2020). : Remaja Rosdakarya.

Gaya MLA

ENCYCLOPEDIA OF PACKAGING MATERIALS, PROCESSES, AND MECHANICS - SET 1: DIE-ATTACH AND WAFER BONDING TECHNOLOGY (A 4-VOLUME SET). . : Remaja Rosdakarya, 2020. Hukum Keluarga Islam (Ahwal Syakhshiyyah).