Gaya APA

AL, B, A, E. (2019). ENCYCLOPEDIA OF PACKAGING MATERIALS, PROCESSES, AND MECHANICS - SET 1: DIE-ATTACH AND WAFER BONDING TECHNOLOGY (A 4-VOLUME SET) . : World Scientific Publishing Co.

Gaya MLA

AL, BAR-COHEN, AVRAM, ET. "ENCYCLOPEDIA OF PACKAGING MATERIALS, PROCESSES, AND MECHANICS - SET 1: DIE-ATTACH AND WAFER BONDING TECHNOLOGY (A 4-VOLUME SET)". : World Scientific Publishing Co, 2019. S2-Pendidikan Bahasa Arab.